Shenzhen Jingxin Electronic Technology Co., Ltd.

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Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

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Good quality EMS PCB Assembly
Good quality EMS PCB Assembly
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EMS PCB Assembly

  • High Precision EMS PCB Assembly suppliers

PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
JINGXIN Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.

 


PCB Assembly Services:


Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly

Conformal coating
Final box-build and packaging

 

 

PCB Assembly Process


Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 


Testing Services


X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe

 


Capabilities


Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…

 

EMS PCB Assembly Sample Introduction

Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

China Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process Supplier
Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process Supplier Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process Supplier

Large Image :  Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

Product Details:

Place of Origin: China
Brand Name: Jingxin
Certification: UL,RoHS, CE
Model Number: JX81107S09

Payment & Shipping Terms:

Minimum Order Quantity: 1 pc
Price: Negotiable
Packaging Details: ESD package
Supply Ability: 100000pcs per day
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Detailed Product Description
Base Material: FR4 Aluminum CEM-1 9 Min. Line Width: 0.10mm (4mil)
Application: Electronic Products PCB Clone: Support
Service: EMS.ODM.OEM Surface Treatment:: HALS/Chemical Tin/S

Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

 

Our capacity

Item (PCB)
Manufacture Capacity
Layer
1-20 layers
Material
FR4, High-TG FR4, CEM3,Aluminum,High Frequency(Rogers, Taconic,Aron,PTFE,F48)
Material Thickness (mm)
0.2 to 4.0mm/Flex 0.01-0.25mm
Copper Thickness
0.5-3.0oz
Min Line Space
0.1mm(4mil)
Min Line Width
0.1mm(4mil)
Hole
 
Min Hole Size (mechanical)
0.2mm
Min Hole Size(laser)
0.1mm
Hole Size Tol(+/-)
PTH: ±0.075mm; NPTH:±0.05mm
Hole Position Tol
±0.075mm
Plating
 
HASL/LF HAL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5"
Surface Finish
HAL, ENIG, Plated Gold, Immersion Gold, OSP
Copper Weight
0.5-6oz
Color
 
Solder Mask
Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silk Screen
White, Black, Blue, Yellow
Acceptable File Format
Gerber file, Powerpcb,CAD,AUTOCAD,ORCAD, P-CAD,CAM-350,CAM2000
Certificate
ROSH, ISO9001,UL
Item (PCB Assembly)
Manufacture Capacity
Stencil Size
700x700mm
Min IC Pitch
0.2mm
Max PCB Size
1200x500mm
Min PCB Thickness
0.25mm
Min Chip Size
0201(0.2x001)/0603(0.6x0.3mm)
Max BGA Size
74x74mm
BGA Ball Diameter
0.4mm(min),1.00mm(max)
BGA Ball Pitch
1.00(min), 3.00mm(max)
QFP Lead Pitch
0.38mm(min),2.54mm(max)
Assembly Type
Surface Mounting Assembly
DIP Assembly
Mixed (surface mount and through hole) technology
Single or double sided placement
Cable Assembly

 
Component Type
Passive Component
As small as 0402 package
As small as 0201 with design review
Ball Grid Array (BGA)

 
Solder Type
Leaded
Leaded-free/ROHS
Other Capabilities
Repair/Rework Service
Mechanical Assembly
Mold and Plastic injection

 

 

Our Service


1. PCB design, PCB clone, ODM service, Android PCBA

2. Schematic design and layout

3. Fast PCB&PCBA prototype and mass production

4. Electronic components sourcing services

5. PCB Assembly services:SMT/DIP&THT,BGA repair and reballing

6. ICT, Constant Temperature Burn-in and Function Test

7. Stencil, Cables and Enclosure building

8. Standard Packing and On-Time Delivery

 

9. Support OEM service

 

Requested information for PCB assembly

1. Gerber file of the bare board/ electronic circuit board

2. BOM for PCB assembly (To shorten time, please kindly advise us if there is any acceptable components substitution)

3. Testing Guide & Test Fixtures if necessary

4. Programming files & Programming tool if necessary

5. Schematic if necessary

 

 

About Company

1. Shenzhen Jingxin Electronics Co., Ltd is a manufacturer specialized in PCB&PCBA manufacturing, related R&D over 14 years.

2. One stop turnkey services, including PCB board manufacturing, PCB layout, PCB assembly, components source, PCB board SMT, function testing, quality testing etc.


3. JINGXIN is the direct customer of original QUAL COMM/MTK/REALTEK and worked with Arrow, Avnet, WPG etc famous IC suppliers for over 10 years.

4. With 20 lines of SMT lines, 20 sets of famous brand Wifi testing machines, 500,000pcs of router production capacity.

5. Strict manufacturing and quality test control, machinery and labor work together to ensure testing quality.

6. OEM and ODM are warmly welcome.

7. Certifications: ISO 9001,CE RoHS, Nation High-tech industry.

Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

Lead Time

 

  Sample Mass Production
Single Sided PCB 1-3 days 4-7 days
Double Sided PCB 2-5 days 7-10 days
Malti-layer PCB 7-8 days 10-15 days
PCB Assembly 8-15 days 15-20 days

Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

 

Contact Details
Shenzhen Jingxin Electronic Technology Co., Ltd.

Contact Person: sales

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