The assembly of the printing plate is based on the requirements of the design documents and process specifications, and the electronic components are inserted into the printed circuit board according to a certain regularity, and the assembly process is fixed by fasteners or soldering.
|Flame retardant properties||VO|
|Item number||PCB Manufacturer|
|Brand||PCBA circuit board electronic component assembly|
|Processing technology||Electrolytic foil|
PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology. However, multilayer PCBs make repair, analysis, and field modification of circuits much more difficult and usually impractical.
Payment & Shipping Terms:
|Min.Line Spacking:||0.075mm||Min.Hole Size:||0.2mm|
|Min.Thickness:||0.2mm||Features 1:||Gerber/PCB File Needed|
|Features 2:||100% Testing||Features 3:||2 Years Guarantee|
turnkey pcb manufacturing,
pc board assembly
Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA
1. One of the largest and professional PCB (Printed Circuit Board) manufacturers in China with over 500 staff and 20 years’experience.
2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver, Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
3. BGA,Blind&Buried Via and Impedance Control is accepted.
4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China with 20 years’experience.
7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.
8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA.
9. Also available for 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package.
10. SMD assembly and through-hole components insertion is accepted.
11. IC preprogramming is also accepted.
12. Available for Function verification and burn in testing.
13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .
14. Environmental conformal coating to protect finished PCBA products.
15. Providing Engineering service as end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure.
16. Functional testing,repairs and inspection of the sub-finished and finished goods.
17. High mixed with low volume order is welcomed.
18. Products before delivery should be full quality checked, striving to 100% perfect.
19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.
20. Best service with punctual delivery is always provided for our customers.
|Key Specifications/Special Features|
|1||We JX have 30 PCB production lines and 20 advanced SMT lines with high speed.|
All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP,
QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach
chip +0.1mm on integrated circuit parts.
|3||We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.|
|4||SMT/SMD assembly and through-hole components insertion|
|6||Function verification and burn in testing|
|7||Complete unit assembly (which including plastics, metal box, coil, cable inside and more)|
Engineering including end of life components, obsolete component replace
and design support for circuit, metal and plastic enclosure
|10||Packaging design and production of customized PCBA|
|11||100% quality assurance|
|12||High mixed, low volume order is also welcomed.|
|13||Full component procurement or the substitute components sourcing|
|14||UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant|
|PRODUCTION CAPABILITY OF PCB ASSEMBLY|
|Stencil Size Range||756 mm x 756 mm|
|Min. IC Pitch||0.30 mm|
|Max. PCB Size||560 mm x 650 mm|
|Min. PCB Thickness||0.30 mm|
|Min. Chip Size||0201 (0.6 mm X 0.3 mm)|
|Max. BGA Size||74 mm X 74 mm|
|BGA Ball Pitch||1.00 mm (Min) / F3.00 mm (Max)|
|BGA Ball Diameter||0.40 mm (Min) /F1.00 mm (Max)|
|QFP Lead Pitch||0.38 mm (Min) /F2.54 mm (Max)|
|Frequency of Stencil Cleaning||1 time / 5 ~ 10 Pieces|
|Type of Assembly||SMT and Thru-hole|
|Solder Type||Water Soluble Solder Paste,Leaded and Lead-free|
|Type of Service||Turn-key,Partial Turn-key or consignment|
|File Formats||Bill of Materials(BOM)|
|Components||Passive Down to 0201 Size|
|BGA and VF BGA|
|Leadless Chip Carries/CSP|
|Double Sided SMT Assembly|
|BGA Repair and Reball|
|Part Removal and Replacement|
|Component Packaging||Cut Tape,Tube,Reels,Loose Parts|
|Testing Method||X-RAY Inspection and AOI Test|
|Order of Quantity||High Mixed,Low Volume Order is also welcomed|
|Remarks: In order to get accurate quote,the following information is required|
|1||Complete Data of Gerber Files for the Bare PCB Board.|
Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage
of components for reference.
|3||Please state whether we can use alternative parts for passive components or not.|
|5||Functional Test Time Per Board.|
|6||Quality Standards Required|
|7||Send Us Samples (if available)|
|8||Date of the quote needs to be submitted|
|PRODUCTION CAPABILITY OF PCB|
PRODUCTION CAPABILITY Manufacturing Capability
|Production Type||Layer Count||2L-16L|
|Surface Treatment||HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL
|Cut Lamination||Max. Working Panel size||1000×1200mm|
|Inner Layer||Internal Core Thickness||0.1～2.0mm|
|Internal width/spacing||Min: 4/4mil|
|Internal Copper Thickness||1.0~3.0oz|
|Dimension||Board Thickness Tolerance||±10%|
|Drilling||Manufacture Panel Size||Max: 650×560mm|
|Hole Diameter Tolerance||±0.05mm|
|Hole Position Tolerance||±0.076mm|
|PTH+Panel Plating||Hole Wall copper Thickness||≧20um|
|Outer Layer||Track Width||Min: 0.08mm|
|Track Spacing||Min: 0.08mm|
|Pattern Plating||Finished Copper Thickness||1oz～3oz|
|EING/Flash Gold||Nickel Thickness||2.5um~5.0um|
|Solder Mask Bridge||3mil|
|Legend||Line width/Line spacing||6/6mil|
|Gold Finger||Nickel Thickness||≧120u〞|
|Hot Air Level||Tin Thickness||100～300u〞|
|Routing||Tolerance of Dimension||±0.1mm|
|Remain Thickness Tolerance||±0.1mm|
|Laser Drilling Size||4mil(0.1mm)|
|Special Requirements||Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable