FPC SMT Quick Turn PCBA 0.3-3.5mm Thickness Multilayer PCB Fabrication
Material | FR4 Tg140 Shengyi | Colour | Green,yellow,blue |
---|---|---|---|
Copper Thickness | 1oz | Acceptable Standard | IPC-A-610F Class II Or III |
Surface Finish | ENIG | Type | Custom Made |
Product Name | Printed Circuit Board | Application | Communication Phone |
Pcb Test | Electrical Test | Min.hole Size | 0.15mm |
Silkscreen Color | White,yellow | Layers | 2 |
Size | 214*220mm | ||
High Light | FPC SMT Quick Turn PCBA,3.5mm Thickness Multilayer Pcb Fabrication,FPC SMT Multilayer PCB Fabrication |
2-layer PCB, FPC, SMT, PCBA, quick-turnaroud PCB Chinese manufacturer
IBE Manufacturing’s facility is specifically designed to yield a J-STD-001 Class 3 board, sub-assembly and system every time. From our stencils, to selective and surface mount automation, to our automated optical inspection, to final assembly, inspection and test, we are committed to quality. We have an onsite CIT trainer to provide on-going J-STD training and continuing education to our production team. This means our team is always current with industry standards and able to build, inspect and test to Class 3 standards.
IBE provide High quality and super service to provide quick turn and mass production on rigid PCB:
Technical Capability of rigid PCB | ||||||||||||
Item | Mass production | Small batch production | ||||||||||
Number of Layers | UP TO 18L | UP TO 36L | ||||||||||
Laminate | FR-4,Halogen free, High TG,Cem-3,Al/copper based,high frequency | |||||||||||
Maximum board size | 610*460mm | 1200*600mm | ||||||||||
Board thickness | 0.3-3.5mm | 0.2-6.0mm | ||||||||||
Minimum line width/space | 3/3 mil | 3/3 mil | ||||||||||
Minimum line/space tolerance | +/-20% | +/-10% | ||||||||||
Max.Outer layer copper thickness | 140um | 210um | ||||||||||
Max.Inner layer copper thickness | 105um | 175um | ||||||||||
Min. finished hole size(Mechanical) | 0.2mm | 0.15mm | ||||||||||
Min. finished hole size (laser hole) | 0.075mm | 0.075mm | ||||||||||
Aspect ratio | 10:1 | 12:1 | ||||||||||
Solder Mask Color | Green, Blue, Black,White,Yellow,Red | |||||||||||
Impedance control Tolerance | <=+/-10% | |||||||||||
Surface treatment | Flash Gold | 0.025-0.075um | 0.025-0.5um | |||||||||
Immersion Gold | 0.025-0.1um | 0.1-0.2um | ||||||||||
Sn/Pb Hasl | 1-40um | |||||||||||
Leadfree Hasl | 1-70um | |||||||||||
Immersion Silver | 0.08-0.3um | |||||||||||
OSP(Entek) | 0.2-0.4um | |||||||||||
Gold Finger(Hard Gold Plating ) | 10u''-50u'' | |||||||||||
Other surface treatment also available such as Nickel palladium |
BE Focus on one stop solution
Advanced Equipment