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Multilayer 0.075mm Rigid Flexible Printed Circuit Board Manufacturing HDI
| Place of Origin | China |
|---|---|
| Brand Name | IBE |
| Certification | ISO/TS16949 ISO13485 |
| Model Number | Flexible PCB |
| Minimum Order Quantity | 10 |
| Price | $0.1-$0.5 |
| Packaging Details | ESD bag |
| Delivery Time | 5-8 working days |
| Payment Terms | D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50000pcs/week |
Product Details
| Min. Line Width | 0.075mm/0.075mm(3mil/3mil) | Surface Finishing | ENIG |
|---|---|---|---|
| Copper Thickness | 1oz | Base Material | FR4 |
| Min. Line Spacing | 0.075mm | Board Thickness | 1.6mm |
| Min. Hole Size | 0.25mm | Soldermask Color | Yellow |
| Silkscreen Color | White | Layer | 1-32L |
| High Light | 0.075mm Rigid Flexible Printed Circuit Board,0.075mm multilayer pcb manufacturing,HDI multilayer pcb manufacturing |
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Product Description
With more than 500 experienced workers and technical team, IBE can offer 150,000 square meters per month. Plant covering 200,000 square meters with the imported and maximum precision facilities, manufacturing lines are totally automation, and chemical are the result of the latest research. Meanwhile, you can be sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and TS16949 approval.Our products include 1-10 layers of simple to high density boards;flex circuits and rigid flex boards, which are the substrate of consumer electronic merchandize, communication device, industrial automation machine, IT product, medical equipment and automotive electronics etc.We handle all types of pcb assembly, from basic through hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including telecommunications, aviation, consumer electronics, wireless, medial, automotive and instrumentation.
PCBA Capability
| PCB Manufacturing Capability | |
| PCB Layers: | 1Layers to 18 layer (Max) |
| Board thickness: | 0.13~6.0mm |
| Min line width/space: | 3mil |
| Min mechanical hole size: | 4mil |
| Copper thickness: | 9um~210um(0.25oz~6oz) |
| Max aspect ratio: | 1:10 |
| Max board size: | 400*700mm |
| Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
| Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
| PCB Assembly Capability | |
| Stencil size range: | 1560*450mm |
| Min SMT package: | 0402/1005(1.0x0.5mm) |
| Min IC pitch: | 0.3mm |
| Max PCB Size: | 1200*400mm |
| Min PCB thickness: | 0.35mm |
| Min Chip Size: | 01005 |
| Max BGA Size: | 74*74mm |
| BGA Ball Pitch: | 1.00~3.00mm |
| BGA Ball Diameter: | 0.4~1.0mm |
| QFP Lead Pitch: | 0.38~2.54mm |
| Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Certification:
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.
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