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Contact Person :
Anna
Phone Number :
18620306819
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+18620306819
One Stop Quick Turn PCB Prototypes 2OZ For Wireless Communication Module
| Material: | CEM3 |
|---|---|
| Colour: | Black |
| Size: | 150mm*80mm |
SMT DIP Rigid Flex Custom PCB Design Service Halogen Free Fr4
| Bare Board Size: | Largest: 21.02’’ X 20.07’’ (534mm X 510mm) |
|---|---|
| Min. IC Pitch: | 0.012’’ (0.3mm) |
| QFN Lead Pitch: | 0.012’’ (0.3mm) |
OEM High Frequency Quick Turn PCB Prototypes Design 5*6mm Min
| Number Of Layers: | 1-48 |
|---|---|
| Board Thickness: | (0.1-4mm±10%) |
| Copper Weight: | 0.5-3 0z |
ODM 0.25oz-8oz Prototype SMT Pcb Assembly Electronics Manufacturing
| Base Material: | FR-4/CEM 1/CEM3/ceramic/PTFE/aluminum/copper |
|---|---|
| PCBs:: | Rigid (0-22 Layers), Flexible (1-8 Layers)rigid-flex (1-16 Layers, Flex 8 Layers), MCPCB (aluminum And Copper 1-4 Layers) |
| Board Thickness:: | 0.2mm-10mm |
CEM1 CEM3 Quick Turn PCB Prototypes Multilayer Pcb Fabrication
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
Green Red Blue dip Quick Turn Pcb Assembly Services 3oz Copper Thickness
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
Hight TG Quick Turn PCB Prototypes Immersion Gold 2oz Copper Clad Board
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
IBE PCB Design And Manufacturing Assembly ISO13485 ISO14001
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
EMS Quick Turn PCB Prototypes HASL OSP Contract Electronic Assembly
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
CEM3 PTFE Prototype PCB Assembly Production Hard Gold Plating
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |