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Keywords [ fr4 hight tg electronic pcba ] match 8 products.
IATF TS16949 Prototype Pcb Manufacturing FR4 Hight TG Electronic Pcba
| Material: | FR4, FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz |
EV Mobile Phone Wireless Charging Fast Charger PCBA Assembly PCB Manufacturer
| Name: | SMT Electronic Components PCB Assembly Service |
|---|---|
| Layer: | 1-58 Layers |
| Application: | Electronics Device |
Immersion Gold Quick Turn PCB Prototypes 2oz Copper Clad Board Hight TG
| Material: | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1-4oz, 3oz，etc. |
Quick Turn Hight TG PCB Prototypes 2oz Copper Clad Board Immersion Gold
| Material: | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1-4oz, 3oz |
Hight TG Quick Turn PCB Prototypes Immersion Gold 2oz Copper Clad Board
| Material: | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Layers: | 1-24layers, 1-28 L |
| Copper Thickness: | 1oz, 0.25 Oz -12 Oz, 1-4oz, 3oz |
Medical Device PCBA FPC Assembly Manufacturer Flex PCB OEM ODM Service
| Board Thickness: | 0.15 |
|---|---|
| Min. Line Width: | 4 Mil |
| Surface Finishing: | Immersion Gold, OSP, HASL,Immersion Gold, Immersion Tin |
PCBA Flexible Printed Circuit Board FPC Assembly Manufacturer PCB OEM ODM
| Board Thickness: | 0.15 |
|---|---|
| Min. Line Width: | 4 Mil |
| Surface Finishing: | Immersion Gold, OSP, HASL,Immersion Gold, Immersion Tin |
PCBA Flexible Printed Circuit Board FPC Assembly Manufacturer PCB OEM ODM
| Board Thickness: | 0.15 |
|---|---|
| Min. Line Width: | 4 Mil |
| Surface Finishing: | Immersion Gold, OSP, HASL,Immersion Gold, Immersion Tin |
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