Full Turnkey 8 Layer EMS PCB Assembly Fabrication Immersion Silver
|Material||Halogen Free||Max Panel Size||8100mm*508mm|
8 Layer EMS PCB Assembly,
Immersion Silver 8 layer pcb fabrication,
EMS full turnkey pcb assembly
Global EMS PCB Assembly in Shenzhen,China
Since 2005, IBE provides Electronics Manufacturing Service (EMS) in China,US,Vietnam. As an ISO 9001 , UL,CSA and CCC certified manufacturer, We offers flexible, cost effective and high quality EMS solutions for printed circuit board assembly (PCBA) and complete product assembly through state of the art manufacturing technologies and production facilities.
With over 15 years manufacturing experience in electronics sectors, IBE is more than a reliable EMS provider for OEMs. Aiming at top notch manufacturing service and total customer satisfaction, we have maintained long term business partnerships with customers all around the world. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense, Aerospace, Medical and Security markets.
Our factory equipped with a variety of assembly technologies including Surface Mount Machine, PTH Insertion, COB, BGA, Flip, Wire Bonding, Box Build and Lead Free Soldering. Our production fact sheet is as following.
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
|1||Material||PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers|
|2||Board Thickness||Mass Production:0.3-3.5mm Samples:0.21-6.0mm|
|3||Surface Finish||HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating|
|4||PCB Panel Size||Max Mass Productoin: 610x460mm Sample:762x508mm|
|5||Layer||Mass production:2-58 Layers, Samples:1-64 Layers|
|6||Min. Drill Hole Size||Laser Drill 0.1mm,Machine Drill 0.2mm|
|7||PCBA QC||X-ray,AOI Test,Functional Test|
|9||Sanforized||Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control|