Automotive Medical Electronics Pcb Pcba CEM1 CEM3 Multilayer Pcb Fabrication
Place of Origin | CHINA,VIETNAM,USA |
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Brand Name | IBE |
Certification | IATF/TS16949,ISO13485,ISO 9001,ISO14001,UL |
Model Number | IBE-133958 |
Minimum Order Quantity | no MOQ |
Price | Negotiable |
Packaging Details | ESD bag+card carton(custom made) |
Delivery Time | 5-10 weeks depends on components lead time |
Payment Terms | L/C, T/T |
Supply Ability | 20000pcs+unit+month |
Material | FR4, FR4 CEM1 CEM3 Hight TG | Layers | 1-24layers, 1-28 L |
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Copper Thickness | 1oz, 0.25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz | Surface Finishing | HASL, ENIG, OSP, Immersion Gold, HASL Lead Free |
Type | Electronic Board, PCBA Design Service | ||
High Light | Automotive Medical Electronics Pcb Pcba,CEM1 CEM3 Multilayer Pcb Fabrication,CEM1 CEM3 Electronics Pcb Pcba |
PCBA design, PCB production,PCB, PCBA, EMS, OEM, ODM manufacturer
IBE is a full-service EMS (Electronic Manufacturing Service) contract manufacturer based in China that provides small to medium volume PCB fabrication and EMS.
Established in 2005, IBE have three manufacturing locations in China,US,Vietnam . In our PCB facility, we produce simple to complex products from 1 to 40 layers. In our EMS facility, we can do conventional thru-hole assembly, SMT assembly including BGA assembly, turnkey box build, supply chain management, project management, new product introduction, testing and product development.
Our Advantages:
1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
7 | PCBA QC | X-ray,AOI Test,Functional Test |
8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |