Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication

Place of Origin CHINA,VIETNAM,USA
Brand Name IBE
Minimum Order Quantity 1000pcs
Price Negotiable
Packaging Details BAG
Delivery Time 15 WORKING DAYS
Payment Terms L/C, T/T
Product Details
Color Green,Blue,Black,White,Yellow,Red,Grey
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Immersion Silver SMT PCB Assembly

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FR4 Tg170 Printed Circuit Board Fabrication

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FR4 Tg170 SMT PCB Assembly

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Product Description

Surface Mount PCB Assembly

Surface-mount technology (SMT) permits the creation of smaller PCB designs by allowing components to be placed closer together on the board. This means devices can be designed to be more lightweight and compact.

 

Our Advantages

1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam

3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test

 

1 Material PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2 Board Thickness Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3 Surface Finish HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4 PCB Panel Size Max Mass Productoin: 610x460mm Sample:762x508mm
5 Layer Mass production:2-58 Layers, Samples:1-64 Layers
6 Min. Drill Hole Size Laser Drill 0.1mm,Machine Drill 0.2mm
7 PCBA QC X-ray,AOI Test,Functional Test
8 Speciality Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9 Sanforized Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

 

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Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication 0