Aluminum BT Rogers Rigid Flex SMT PCB Assembly IATF TS16949 ISO13485

Brand Name IBE
Certification IATF/TS16949,ISO13485,ISO 9001,ISO14001,UL,ROHS
Model Number FG-02
Minimum Order Quantity NO MOQ
Price Negotiable
Packaging Details BAG
Delivery Time 15 WORKING DAYS
Payment Terms L/C, T/T
Product Details
Colour White Name PCB Assembly
Surface Technical Immersion Silver Layer Count 6
Material Aluminum Max Panel Size 800mm*508mm
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Aluminum BT Rogers SMT PCB Assembly


ISO13485 rigid flex pcb assembly


SMT PCB Assembly IATF TS16949

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Product Description

IATF/TS16949,ISO13485 Certified SMT PCB Assembly


Production capability

IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and
online SPI machines.Our PCB production capacity is up to 180,000 square meters a month.We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.
We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.

Our Advantages

1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam

3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test


1 Material PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2 Board Thickness Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3 Surface Finish HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4 PCB Panel Size Max Mass Productoin: 610x460mm Sample:762x508mm
5 Layer Mass production:2-58 Layers, Samples:1-64 Layers
6 Min. Drill Hole Size Laser Drill 0.1mm,Machine Drill 0.2mm
7 PCBA QC X-ray,AOI Test,Functional Test
8 Speciality Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9 Sanforized Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control


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