Halogen Free Fr4 Pcb Assembly Printed Circuit Services TS16949

Place of Origin CHINA,VIETNAM,USA
Brand Name IBE
Certification IATF
Model Number FG-02
Minimum Order Quantity NO MOQ
Price Negotiable
Packaging Details BAG
Delivery Time 15 WORKING DAYS
Payment Terms L/C, T/T
Product Details
Colour Black Name PCB Assembly
Layer 6 Material Halogen Free
Max Panel Size 830mm*608mm Surface ENIG
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Fr4 Pcb Assembly Printed Circuit Services

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Halogen Free Fr4 Pcb Assembly

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Halogen Free Printed Circuit Services TS16949

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Product Description

Shenzhen,China EMS PCB Assembly Service

 

Production capability:

 

To shorten the clients' product cycle time to market,IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and
online SPI machines.
Our PCB production capacity is up to 180,000 square meters a month.
We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.
We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.
IBE sticks to the rigorous quality management,procedure control and sets up 100% complete AOI inspection.
We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.
IBE has own R&D center with 30 engineers,they are experienced in software programming,circuit design and mechanical structure design.

 

 

1 Material PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2 Board Thickness Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3 Surface Finish HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4 PCB Panel Size Max Mass Productoin: 610x460mm Sample:762x508mm
5 Layer Mass production:2-58 Layers, Samples:1-64 Layers
6 Min. Drill Hole Size Laser Drill 0.1mm,Machine Drill 0.2mm
7 PCBA QC X-ray,AOI Test,Functional Test
8 Speciality Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9 Sanforized Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

 

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