Communication System Electronic PCBA Surface Mount BGA QFN Assembly
Material | FR4 | Colour | Grey |
---|---|---|---|
Size | 200mm*70mm | Surface | ENIG |
Layer | 12 | Name | PCBA |
High Light | Electronic PCBA BGA QFN Assembly,Communication System PCBA BGA QFN,Communication System electronic pcba |
Communication System PCBA BGA QFN Assembly
PCBA Capability
SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.
Order Conditions
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Standard Delivery Date
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The fastest Delivery Date
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Prototype ( <20pcs)
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2days
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8hours
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Small Volume (20-100pcs)
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6days
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12hours
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Medium Volume (100-1000)
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3days
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24hours
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Mass Production (>1000)
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Depends on BOM
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Depends on BOM
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