BGA QFN Lead Free Quick Turn PCB Assembly For Charging Module
|Surface Technical||Immersion Silver||Layer Count||6|
|Material||Halogen Free||Max Panel Size||760mm*708mm|
BGA QFN Lead Free pcb assembly,
BGA QFN Lead Free PCB Assembly,
BGA QFN Quick Turn PCB Assembly
Shenzhen Electronics Quick Turn PCB Assembly for charging module
|SMT and Through-Hole Assembly||Fine Pitch Component Insertion|
|Lead free Assembly||BGA and QFN Assembly|
|One-stop PCB Assembly||BGA X-Ray Inspection|
|Prototype PCB Assembly||Automated Optical Inspection|
|PCB Assembly in low volumes||PCB testing for functionality|
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
Advanced Function Test
Flash Device Programming
|Selective Wave Soldering||Conformal Coating|
|Complete box build||Kitting and 3D printing|
Q: What service do you have?
A: We provide PCB,components sourcing,PCB assembly,box build,R &D services.
Q: What is your minimum order quantity (MOQ)?
A:As for MOQ, we have no request about it. Even 1 pcs is ok for us.
Q: What is needed for PCB & PCBA quotation?
A: Gerber fie,Bom list and production technical requirements.
Q: How to keep our product information and design file secret ?
A: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.