3mil Flexible Printed Circuit Board ENIG Electronic Board Assembly
Min. Line Width | 0.075mm/0.075mm(3mil/3mil) | Surface Finishing | ENIG |
---|---|---|---|
Copper Thickness | 1oz | Base Material | FR4 |
Min. Line Spacing | 0.075mm | Board Thickness | 1.6mm |
Min. Hole Size | 0.25mm | Soldermask Color | Green |
Silkscreen Color | White | Layer | 1-32L |
High Light | 3mil Flexible Printed Circuit Board,ENIG Electronic Board Assembly,3mil Electronic Board Assembly |
Flexible Printed Circuit Board PCB for PCB Assembly, Electronic Products
IBE was founded in 2005 with a goal of providing the bridge for customer success when it came to procuring bare printed circuit boards. Our founders believed this could be achieved by providing quality PCBs at a competitive price along with taking customer service expectations to the next level. Over the last 15 years, IBE has morphed into a world-class operation while remaining customer-centric by means of Redefining Customer Service.
PCBA Capability
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.
PCB Manufacturing Capability | |
PCB Layers: | 1Layers to 18 layer (Max) |
Board thickness: | 0.13~6.0mm |
Min line width/space: | 3mil |
Min mechanical hole size: | 4mil |
Copper thickness: | 9um~210um(0.25oz~6oz) |
Max aspect ratio: | 1:10 |
Max board size: | 400*700mm |
Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
PCB Assembly Capability | |
Stencil size range: | 1560*450mm |
Min SMT package: | 0402/1005(1.0x0.5mm) |
Min IC pitch: | 0.3mm |
Max PCB Size: | 1200*400mm |
Min PCB thickness: | 0.35mm |
Min Chip Size: | 01005 |
Max BGA Size: | 74*74mm |
BGA Ball Pitch: | 1.00~3.00mm |
BGA Ball Diameter: | 0.4~1.0mm |
QFP Lead Pitch: | 0.38~2.54mm |
Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Order Conditions
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Standard Delivery Date
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The fastest Delivery Date
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Prototype ( <20pcs)
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2days
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8hours
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Small Volume (20-100pcs)
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6days
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12hours
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Medium Volume (100-1000)
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3days
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24hours
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Mass Production (>1000)
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Depends on BOM
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Depends on BOM
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FAQ:
1. What’s a motherboard?
A motherboard is a printed circuit assembly(PCA) used exclusively in laptop or desktop computers. While some may refer to a PCA as a motherboard,only those found in computers are motherboards. All other printed circuit assemblies are simply PCA or PCBA.
2.How does a printed circuit board assembly (PCB assembly) work?
The primary function of a PCB assembly is to integrate the electronic components of a device into a compact or defined space. Acting as the central hub of the electronic circuit of a device, the PCB provides insulation for all other electrical components, allowing them to be safely connected to a power source.
3. What information is required for a turnkey PCB assembly order?
For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file
4. Are you UL / Underwriters Laboratory approved?
IBE pursues all applicable UL certifications for our products, and we offer several products certified with UL and CSA based on customer’s demand
Underwriters Laboratories (UL) grants multiple certifications, including:
IBE is certified for PCB by UL file E326838
5. Do you offer RoHS&REACH-compliant assemblies?
Yes, IBE does offer assemblies that comply with the European Union’s Restriction of Hazardous Substances (RoHS) Directive and REACH.