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IBE SMT BGA PCB Assembly Flash Gold Finger For Electric Power Equipment
| Place of Origin | CHINA,VIETNAM,USA |
|---|---|
| Brand Name | IBE |
| Certification | TS16949 |
| Model Number | FG-01 |
| Minimum Order Quantity | NO MOQ |
| Price | Negotiable |
| Packaging Details | BAG |
| Delivery Time | 15 WORKING DAYS |
| Payment Terms | L/C, T/T |
Product Details
| Material | FR4 | Colour | Red |
|---|---|---|---|
| Size | 220mm*60mm | Surface | HASL |
| Layer | 12 | Name | PCBA |
| High Light | BGA PCB Assembly Flash Gold Finger,IBE SMT BGA PCB Assembly,Flash Gold Finger SMT PCB Assembly |
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Product Description
IBE OEM/ODM Electric Power Equipment PCBA in Shenzhen,China
PCBA Capability
Printed circuit board assembly is the process of connecting the electronic components with the wirings of printed circuit boards. The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
Professional Engineering Team: We’re highly qualified and dedicated to the success of your project, allowing you to start with optimized designs and giving you a better chance to meet project deadlines.
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Weight | 1.8KG | ||
| Special dimension | 1200*400*4.2 | ||
| Material | FR-4,CEM-1,CEM-3,Aluminium-based board,FPC | ||
| Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
| Components | Chip&IC | 0201(0.5*0.25) | 55mm |
| BGA Pitch | 0.3mm | ||
| QFP Pitch | 0.3mm | ||
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