High Frequency Industrial PCB Assembly Design 0.13-6.0mm Thickness

Brand Name IBE
Certification ISO 9001
Model Number FG-07
Minimum Order Quantity NO MOQ
Price Negotiable
Packaging Details BAG
Delivery Time 15 WORKING DAYS
Payment Terms L/C, T/T
Product Details
Material Rogers Colour Black
Size 230mm*70mm Surface ENIG
Layer 10 Name Industrial Automation PCB Assembly
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Industrial PCB Assembly 6.0mm Thickness


high frequency pcb design 6.0mm Thickness


High Frequency Industrial PCB Assembly

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Product Description

High Frequency Industrial PCB Assembly Design 0.13-6.0mm Thickness 0


High Frequency Industrial PCB Assembly Design 0.13-6.0mm Thickness 1

High Frequency Industrial PCB Assembly Design 0.13-6.0mm Thickness 2

High Frequency Industrial PCB Assembly Design 0.13-6.0mm Thickness 3

PCBA Capability

PCB Manufacturing Capability
PCB Layers: 1Layers to 18 layer (Max)
Board thickness: 0.13~6.0mm
Min line width/space: 3mil
Min mechanical hole size: 4mil
Copper thickness: 9um~210um(0.25oz~6oz)
Max aspect ratio: 1:10
Max board size: 400*700mm
Surface Finish: HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material: FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range: 1560*450mm
Min SMT package: 0402/1005(1.0x0.5mm)
Min IC pitch: 0.3mm
Max PCB Size: 1200*400mm
Min PCB thickness: 0.35mm
Min Chip Size: 01005
Max BGA Size: 74*74mm
BGA Ball Pitch: 1.00~3.00mm
BGA Ball Diameter: 0.4~1.0mm
QFP Lead Pitch: 0.38~2.54mm
Testing : ICT,AOI,X-RAY,Funtional test etc.


Material Type Item Min Max
PCB Dimension (length,width,height.mm) 30*40*0.38 700*400*4.2
Weight   1.8KG
Special dimension   1400*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 0201(0.5*0.25) 55mm
BGA Pitch 0.2mm  
QFP Pitch 0.3mm  

Industries IBE serves for:

Industry control
Automotive Electronics
Medical Care
Consumer Electronics
Telecom and Security
Metering and Instrument
LED lighting and display

What Services IBE provides:

IBE PCBA capabilities include:

Fast prototyping
High mix, low/medium volume build
Surface mounting technology (SMT MinChip:0201) and Ball Grid Array (BGA: 1.0 to 3.0 mm pitch)
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability

IPC-A-610E and IPC/EIA-STD workmanship operation
UL Certificated: E326838

Test solutions include:

Automatic optical inspection(AOI)
In-circuit test (ICT)
Reliability test

X-Ray Test
Analogue and digital function test

Firmware programming

Quality Assurance:

ISO9001 and ISO14001 management systems
Lean production system

ERP and PTS system support for management

IBE believe that only by always delivering the products that meet or exceed your quality requirements, could we earn your continuous trust as your reliable EMS partner.
In order to assure the quality in every level of assembly, we employ a strict quality management system to control the whole production process.

Our Quality processes include:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

Supply Chain:

We have a professional procurement team with rich experience in sourcing molding, stamping, forming, and injection. And we employ a comprehensive supply chain evaluation system for our suppliers.

In order to choose the best options for our customers' needs on overall competitiveness, IBE would benchmark all our suppliers, based on their quality and environment management systems, flexibility, services, capacity, sustainability, and total cost of ownership.

Both our procurement and engineer team work with all our customers at the initial quote stage to devise the most suitable and competitive sourcing strategy for our customers, based on their product requirements and under their confirmation. In this way, we could indentify and catch every cost reduction opportunities for the customers and reach the lowest total cost of the project.