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Rogers Power Switch PCB Quick Turn PCBA Hard Gold Plating ISO13485
| Place of Origin | CHINA,VIETNAM,USA |
|---|---|
| Brand Name | IBE |
| Certification | UL |
| Model Number | FG-09 |
| Minimum Order Quantity | NO MOQ |
| Price | Negotiable |
| Packaging Details | BAG |
| Delivery Time | 15 WORKING DAYS |
| Payment Terms | L/C, T/T |
Product Details
| Material | Rogers | Colour | White |
|---|---|---|---|
| Size | 130mm*100mm | Surface | HASL |
| Layer | 8 | Name | PCB Assembly |
| High Light | ISO13485 Rogers Power Switch PCB,ISO13485 Quick Turn PCB Assembly,PCBA Hard Gold Plating |
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Product Description
Power Switch Board PCBA Certified by ISO13485
PCBA Capability
We’re highly qualified and dedicated to the success of your project, allowing you to start with optimized designs and giving you a better chance to meet project deadlines.
Printed circuit board assembly is the process of connecting the electronic components with the wirings of printed circuit boards. The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
Everything is assembled here under the supervision of expert engineers. If you want to launch your product and uncertain about circuit boards, our team is 24/7 ready to help you.
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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