Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey

Place of Origin CHINA,VIETNAM,USA
Brand Name IBE
Certification ISO14001
Model Number FG-6
Minimum Order Quantity NO MOQ
Price Negotiable
Packaging Details BAG
Delivery Time 15 WORKING DAYS
Payment Terms L/C, T/T
Product Details
Material Halogen Free Colour Blue
Size 160mm*220mm Surface ENIG
Layer 6 Name PCBA
High Light

6 Layer Rigid Flex PCB Assembly

,

Fine Pitch Assembly Full Turnkey

,

Full Turnkey rigid flex pcb assembly

Leave a Message
Product Description

OEM/ODM Rigid, Flexible, and Rigid-Flex PCBA Fine pitch assembly

PCBA Capability

  • PCB Types: Rigid, Flexible, and Rigid-Flex PCBs. MCPCBs, Ceramic PCBs, and Rogers PCBs.
  • Layer Count: We can assemble 1 to 40 layers. (Or according to client requirements)
  • Minimum Size: 30 mm
  • Maximum Size: For Single Board 500 mm x 400 mm. For panel board 310 mm x 410 mm.
  • Surface Finishes: Gold Plated, Lead or Lead-free, OSP, etc.
  • Board Shape: We can assemble circular, rectangular, and any opaque shape. While choosing shape other than a rectangle, you will have to penalize PCB in an array.
  • Minimum Order: You can place an order for at least 5 pieces. For further details, you can contact our team.
  • Assembly Options: You can ask for THT, SMT, hybrid or both. Plus, you can go with single and double-sided placement.
  • Repair & Rework: Repairing and reworking is a very difficult job. You can still contact our team for a better solution.
  • SMT Production Capacity: We are capable to produce 10 million chips per day in the case of 5 SMT lines. And, 8 million per day in the case of 0402 and 0201.
  • DIP Production Capacity: The company can produce 1.2 million pcs per day for 3 Production Lines.
  • Lead Time: This time depends on the order. However, our usual assembly time is between 24 hours and 1 week. The time can vary on the bases of printed board assembly complexity. It might take more time for custom designs. However, we will deliver boards within the due date.
  • SMT production capacity: 5 SMT Lines(10 million chips per day (0402, 0201 with 8 million per day)
  • DIP production capacity: 3 Production Lines(1.2 million pcs per day)
  • Enclosure assembly:3 Production Lines for enclosure assembly(Each line has 15 assemblers and 2 quality control engineers)
  • Fine pitch assembly: down to 01005, 0201 size
  • High accuracy placement:down to 4mil(0.1mm) pitch devices

 

Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey 0

Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey 1

Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey 2

Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey 3

Blue 6 Layer Rigid Flex PCB Assembly Fine Pitch Assembly Full Turnkey 4