FR4 Tg170 2OZ Copper PCB Double Sided Printed Circuit Board
Material | FR4 Tg170 | Colour | Green,yellow,blue |
---|---|---|---|
Copper Thickness | 2oz | Acceptable Standard | IPC-A-610F Class II Or III |
+hard Gold PlatedSurface | Gold Plated | Type | Custom Made |
Product Name | Printed Circuit Board | Application | Communication |
Pcb Test | Electrical Test | Min.hole Size | 0.15mm |
Silkscreen Color | White,yellow | Layers | 2 |
Size | 115*210mm | ||
High Light | FR4 Tg170 2OZ Copper PCB,Tg170 Double Sided Printed Circuit Board,Double Sided 2OZ Copper PCB |
2 layers PCB, Double-side pcb,ENIG,2OZ copper UL 94v0 for communication equipment
With more than a decade in the field of PCB prototype and fabrication, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers in China/US/Vietnam, we pride ourselves to be your best business partners as well as good friends in the every aspect of your PCB needs.
IBE is a longstanding provider of surface mount PCB assembly services for customers in a range of industries. We specialize in contract manufacturing and have extensive experience with assembling electronics for a wide range of applications. With a broad selection of equipment and expert staff, we can assist with product prototyping and testing, contract manufacturing and more.
IBE provide High quality and super service to provide quick turn and mass production on rigid PCB:
Technical Capability of rigid PCB | ||||||||||||
Item | Mass production | Small batch production | ||||||||||
Number of Layers | UP TO 18L | UP TO 36L | ||||||||||
Laminate | FR-4,Halogen free, High TG,Cem-3,Al/copper based,high frequency | |||||||||||
Maximum board size | 610*460mm | 1200*600mm | ||||||||||
Board thickness | 0.3-3.5mm | 0.2-6.0mm | ||||||||||
Minimum line width/space | 3/3 mil | 3/3 mil | ||||||||||
Minimum line/space tolerance | +/-20% | +/-10% | ||||||||||
Max.Outer layer copper thickness | 140um | 210um | ||||||||||
Max.Inner layer copper thickness | 105um | 175um | ||||||||||
Min. finished hole size(Mechanical) | 0.2mm | 0.15mm | ||||||||||
Min. finished hole size (laser hole) | 0.075mm | 0.075mm | ||||||||||
Aspect ratio | 10:1 | 12:1 | ||||||||||
Solder Mask Color | Green, Blue, Black,White,Yellow,Red | |||||||||||
Impedance control Tolerance | <=+/-10% | |||||||||||
Surface treatment | Flash Gold | 0.025-0.075um | 0.025-0.5um | |||||||||
Immersion Gold | 0.025-0.1um | 0.1-0.2um | ||||||||||
Sn/Pb Hasl | 1-40um | |||||||||||
Leadfree Hasl | 1-70um | |||||||||||
Immersion Silver | 0.08-0.3um | |||||||||||
OSP(Entek) | 0.2-0.4um | |||||||||||
Gold Finger(Hard Gold Plating ) | 10u''-50u'' | |||||||||||
Other surface treatment also available such as Nickel palladium |
BE Focus on one stop solution