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Fr4 Polyimide 6 Layer Flex Rigid PCB Design HASL Immersion Gold
| Place of Origin | China |
|---|---|
| Brand Name | IBE |
| Certification | ISO/TS16949 ISO13485 |
| Model Number | Flex Rigid PCB |
| Minimum Order Quantity | 10 |
| Price | $0.1-$0.5 |
| Packaging Details | ESD bag |
| Delivery Time | 5-8 working days |
| Payment Terms | D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 50000pcs/week |
Product Details
| Min. Line Width | 0.075mm/0.075mm(3mil/3mil) | Surface Finishing | ENIG |
|---|---|---|---|
| Copper Thickness | 1oz | Base Material | FR4 |
| Min. Line Spacing | 0.075mm | Board Thickness | 1.6mm |
| Min. Hole Size | 0.25mm | Soldermask Color | Green |
| Silkscreen Color | White | Layer | 1-32L |
| High Light | Fr4 Polyimide 6 layer circuit board,6 layer pcb design HASL Immersion Gold,Immersion Gold 6 layer circuit board |
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Product Description
6 Layer Rigid&Flex PCB Fr4 Polymide Customized Circuit Board Manufacture
With more than 500 experienced workers and technical team, IBE can offer 15,000 square meters per month. Plant covering 200,000 square meters with the imported and maximum precision facilities, manufacturing lines are totally automation, Meanwhile, you can be sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and TS16949 approval.Our products include 1-10 layers of simple to high density boards;flex circuits and rigid flex boards, which are the substrate of consumer electronic merchandize, communication device, industrial automation machine, IT product, medical equipment and automotive electronics etc.We handle all types of pcb assembly, from basic through hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including telecommunications, aviation, consumer electronics, wireless, medial, automotive and instrumentation.
PCBA Capability
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.
| PCB Manufacturing Capability | |
| PCB Layers: | 1Layers to 18 layer (Max) |
| Board thickness: | 0.13~6.0mm |
| Min line width/space: | 3mil |
| Min mechanical hole size: | 4mil |
| Copper thickness: | 9um~210um(0.25oz~6oz) |
| Max aspect ratio: | 1:10 |
| Max board size: | 400*700mm |
| Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
| Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
| PCB Assembly Capability | |
| Stencil size range: | 1560*450mm |
| Min SMT package: | 0402/1005(1.0x0.5mm) |
| Min IC pitch: | 0.3mm |
| Max PCB Size: | 1200*400mm |
| Min PCB thickness: | 0.35mm |
| Min Chip Size: | 01005 |
| Max BGA Size: | 74*74mm |
| BGA Ball Pitch: | 1.00~3.00mm |
| BGA Ball Diameter: | 0.4~1.0mm |
| QFP Lead Pitch: | 0.38~2.54mm |
| Testing : | ICT,AOI,X-RAY,Funtional test etc. |
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