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multilayer 800mm*508mm Printed Circuit Board Fabrication HASL OSP
| Place of Origin | CHINA,VIETNAM,USA |
|---|---|
| Brand Name | IBE |
| Certification | IATF/TS16949,ISO13485,ISO 9001,ISO14001,UL,ROHS |
| Model Number | FG-03 |
| Minimum Order Quantity | NO MOQ |
| Price | Negotiable |
| Packaging Details | BAG |
| Delivery Time | 15 WORKING DAYS |
| Payment Terms | L/C, T/T |
Product Details
| Colour | Green,Blue,Black,White,Yellow,Red,Grey | Name | PCB Assembly |
|---|---|---|---|
| Surface Technical | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating | Layer Count | 2-18 |
| Material | FR4,Halogen Free, High TG,CEM3,PTFE,Aluminum BT,Rogers | Max Panel Size | 800mm*508mm |
| High Light | Printed Circuit Board Fabrication HASL OSP,800mm*508mm printed circuit board fabrication,800mm*508mm multilayer printed circuit board |
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Product Description
IBE Introduction
IBE is a professional PCB,SMT,PCB assembly, components sourcing and box build provider for global electronics manufacturing services(EMS).Our products are widely applied in Automotive,Medical,Defense and Aerospace,Power Supply,Smart Metering industry,etc.
We've good cooperation with many famous enterprises,such as Flextronics,Foxconno,ABB,AEC,Jabil,Valeo,Bushnell,Sanmina, Grammer and so on.
We keep making breakthroughs in technology and production to lead the EMS industrial and build a one-stop solution integrating material purchasing, production processing and finished product reliability test which enable our customer to achieve meaningful time to market and save cost.
Our Advantages
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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