New Energy Battery Aluminum BT Turnkey PCB Assembly Flash Gold
Colour | Grey | Name | PCB Assembly |
---|---|---|---|
Surface Technical | Flash Gold | Layer Count | 9 |
Material | Aluminum BT | Max Panel Size | 800mm*508mm |
High Light | New Energy Battery Turnkey PCB Assembly,Aluminum BT Turnkey PCB Assembly,Turnkey New Energy Battery PCB |
New Energy Battery Turnkey PCB assembly
About IBE Corporation
Founded in 1998, IBE Corporation is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services. IBE facilities span a broad footprint in the China,United States and Vietnam.
While we are experts in electronics manufacturing services, our customers look to us to provide valuable resources and insight necessary to help them grow. Our team understands lean manufacturing and deploys business management strategies to improve manufacturing processes while eliminating defects. Our Technical Services group of highly experienced engineers provides recommendations on testing and additional steps necessary to protect the final electronic product. Each of our facilities is dedicated to system assembly and box build services. IBE even provides order fulfillment services including direct order processing, pick and pack and final product configuration.
Our Advantages
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
7 | PCBA QC | X-ray,AOI Test,Functional Test |
8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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