To shorten the clients' product cycle time to market,IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and online SPI machines.
We’re highly qualified and dedicated to the success of your project, allowing you to start with optimized designs and giving you a better chance to meet project deadlines.Everything is assembled here under the supervision of expert engineers. If you want to launch your product and uncertain about circuit boards, our team is 24/7 ready to help you.
||PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
||Mass Production:0.3-3.5mm Samples:0.21-6.0mm
||HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
||PCB Panel Size
||Max Mass Productoin: 610x460mm Sample:762x508mm
||Mass production:2-58 Layers, Samples:1-64 Layers
||Min. Drill Hole Size
||Laser Drill 0.1mm,Machine Drill 0.2mm
||X-ray,AOI Test,Functional Test
||Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control