ENIG PCB PCBA Assembly Electronic Component Sourcing Plastic Molding
ENIG Pcb Pcba Assembly,
ENIG PCB Electronic Component Sourcing,
Plastic Molding PCB PCBA Assembly
IBE is a professional PCB,SMT,PCB assembly, components sourcing and box build provider for global electronics manufacturing services(EMS).
Our PCB production capacity is up to 180,000 square meters a month.
We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.
We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.
IBE sticks to the rigorous quality management,procedure control and sets up 100% complete AOI inspection.
We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.
Everything is assembled here under the supervision of expert engineers. If you want to launch your product and uncertain about circuit boards, our team is 24/7 ready to help you.
1. Flexible operation-provide prototype and quick delivery.
2. Competitive price-strong material sourcing team,always get the best price to help you save cost.
3. Big global processing and manufacturing bases-located in Shenzhen,Dongguan,Wuping of China,Portland of America and Vietnam.
4. High quality products-well equipped and strictly managed,stick to rigorous quality management,procedure control and sets up 100% automatic AOI inspection.
Certified by ISO 9001,ISO14001,TS16949,ISO13485,UL and Disney FAMA etc.
5. One stop solution- integrating material puchasing,production processing and finished product reliability test.
|1||Material||PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers|
|2||Board Thickness||Mass Production:0.3-3.5mm Samples:0.21-6.0mm|
|3||Surface Finish||HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating|
|4||PCB Panel Size||Max Mass Productoin: 610x460mm Sample:762x508mm|
|5||Layer||Mass production:2-58 Layers, Samples:1-64 Layers|
|6||Min. Drill Hole Size||Laser Drill 0.1mm,Machine Drill 0.2mm|
|7||PCBA QC||X-ray,AOI Test,Functional Test|
|9||Sanforized||Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control|