ENIG LED Smt Electronics Flex Pcb Manufacturing ISO TS16949
Min. Line Width | 0.075mm/0.075mm(3mil/3mil) | Surface Finishing | ENIG |
---|---|---|---|
Copper Thickness | 1oz | Base Material | FR4 |
Min. Line Spacing | 0.075mm | Board Thickness | 1.6mm |
Min. Hole Size | 0.25mm | Soldermask Color | Green |
Silkscreen Color | White | Layer | 1-32L |
High Light | smt electronics flex pcb manufacturing,ENIG LED smt electronics manufacturing,Flex Pcb Manufacturing ISO TS16949 |
Customized Fr4 Polyimide LED Rigid-Flex PCBA PCB Manufacturing
About IBE Corporation
Founded in 2005, IBE Corporation is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services. IBE facilities span a broad footprint in the China,United States and Vietnam. IBE services extend over the entire electronic product life cycle from the development and introduction of new products through to the growth, maturity and end-of-life phases.
Certification:
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.
PCB Manufacturing Capability | |
PCB Layers: | 1Layers to 18 layer (Max) |
Board thickness: | 0.13~6.0mm |
Min line width/space: | 3mil |
Min mechanical hole size: | 4mil |
Copper thickness: | 9um~210um(0.25oz~6oz) |
Max aspect ratio: | 1:10 |
Max board size: | 400*700mm |
Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
PCB Assembly Capability | |
Stencil size range: | 1560*450mm |
Min SMT package: | 0402/1005(1.0x0.5mm) |
Min IC pitch: | 0.3mm |
Max PCB Size: | 1200*400mm |
Min PCB thickness: | 0.35mm |
Min Chip Size: | 01005 |
Max BGA Size: | 74*74mm |
BGA Ball Pitch: | 1.00~3.00mm |
BGA Ball Diameter: | 0.4~1.0mm |
QFP Lead Pitch: | 0.38~2.54mm |
Testing : | ICT,AOI,X-RAY,Funtional test etc. |
1. What’s a motherboard?

A motherboard is a printed circuit assembly(PCA) used exclusively in laptop or desktop computers. While some may refer to a PCA as a motherboard,only those found in computers are motherboards. All other printed circuit assemblies are simply PCA or PCBA.
2.How does a printed circuit board assembly (PCB assembly) work?

The primary function of a PCB assembly is to integrate the electronic components of a device into a compact or defined space. Acting as the central hub of the electronic circuit of a device, the PCB provides insulation for all other electrical components, allowing them to be safely connected to a power source.
3. What information is required for a turnkey PCB assembly order?
For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file