Flash Gold Rogers HDI Multilayer PCBs Manufacturing Immersion Silver
Flash Gold Rogers HDI Multilayer PCBs,
ENIG multilayer pcb manufacturing,
Immersion Silver HDI Multilayer PCBs
Flash Gold HDI Multilayer PCBs
IBE provides better, faster and more cost-effective solutions to our customers' most challenging design for excellence (DFx) problems. From manufacturing to testing to supply chain, IBE provides customized design support to our OEM partners, enabling them to establish a strong competitive position within their marketplace.
We have a proven record of guiding manufacturers throughout the entire electronics manufacturing process. From simple designs to complex system integration, IBE provides the end-to-end electronics manufacturing services necessary to compete in a global marketplace.
1, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam.
2, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
3, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
4, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
|1||Material||PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers|
|2||Board Thickness||Mass Production:0.3-3.5mm Samples:0.21-6.0mm|
|3||Surface Finish||HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating|
|4||PCB Panel Size||Max Mass Productoin: 610x460mm Sample:762x508mm|
|5||Layer||Mass production:2-58 Layers, Samples:1-64 Layers|
|6||Min. Drill Hole Size||Laser Drill 0.1mm,Machine Drill 0.2mm|
|7||PCBA QC||X-ray,AOI Test,Functional Test|
|9||Sanforized||Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control