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UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold
Product Details
Surface Finishing | ENIG | Copper Thickness | 1oz |
---|---|---|---|
Base Material | FR4 | Min. Line Spacing | 0.075mm |
Board Thickness | 1.6mm | Min. Hole Size | 0.25mm |
Soldermask Color | Green | Silkscreen Color | White |
Layer | 1-32L | ||
High Light | Rfid Printed Circuit Board Fabrication,UL 16L rfid circuit board,immersion gold rfid circuit board |
Product Description
China multilayer pcb manufacturing pcb fabrication 16L RFID PCB with UL approval
PCBA Capability
PCB Manufacturing Capability | |
PCB Layers: | 1Layers to 18 layer (Max) |
Board thickness: | 0.13~6.0mm |
Min line width/space: | 3mil |
Min mechanical hole size: | 4mil |
Copper thickness: | 9um~210um(0.25oz~6oz) |
Max aspect ratio: | 1:10 |
Max board size: | 400*700mm |
Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
PCB Assembly Capability | |
Stencil size range: | 1560*450mm |
Min SMT package: | 0402/1005(1.0x0.5mm) |
Min IC pitch: | 0.3mm |
Max PCB Size: | 1200*400mm |
Min PCB thickness: | 0.35mm |
Min Chip Size: | 01005 |
Max BGA Size: | 74*74mm |
BGA Ball Pitch: | 1.00~3.00mm |
BGA Ball Diameter: | 0.4~1.0mm |
QFP Lead Pitch: | 0.38~2.54mm |
Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Delivery Time:
Order Conditions
|
Standard Delivery Date
|
The fastest Delivery Date
|
Prototype ( <20pcs)
|
2days
|
8hours
|
Small Volume (20-100pcs)
|
6days
|
12hours
|
Medium Volume (100-1000)
|
3days
|
24hours
|
Mass Production (>1000)
|
Depends on BOM
|
Depends on BOM
|
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