UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

Place of Origin China
Brand Name IBE
Certification ISO/TS16949 ISO13485
Model Number multilayer pcb
Minimum Order Quantity 10
Price $0.1-$0.5
Packaging Details Vacuum Package
Delivery Time 5-8 working days
Payment Terms D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000pcs/week
Product Details
Surface Finishing ENIG Copper Thickness 1oz
Base Material FR4 Min. Line Spacing 0.075mm
Board Thickness 1.6mm Min. Hole Size 0.25mm
Soldermask Color Green Silkscreen Color White
Layer 1-32L
High Light

Rfid Printed Circuit Board Fabrication

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UL 16L rfid circuit board

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immersion gold rfid circuit board

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Product Description

China multilayer pcb manufacturing pcb fabrication 16L RFID PCB with UL approval

PCBA Capability

PCB Manufacturing Capability
PCB Layers: 1Layers to 18 layer (Max)
Board thickness: 0.13~6.0mm
Min line width/space: 3mil
Min mechanical hole size: 4mil
Copper thickness: 9um~210um(0.25oz~6oz)
Max aspect ratio: 1:10
Max board size: 400*700mm
Surface Finish: HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material: FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
   
PCB Assembly Capability
Stencil size range: 1560*450mm
Min SMT package: 0402/1005(1.0x0.5mm)
Min IC pitch: 0.3mm
Max PCB Size: 1200*400mm
Min PCB thickness: 0.35mm
Min Chip Size: 01005
Max BGA Size: 74*74mm
BGA Ball Pitch: 1.00~3.00mm
BGA Ball Diameter: 0.4~1.0mm
QFP Lead Pitch: 0.38~2.54mm
Testing : ICT,AOI,X-RAY,Funtional test etc.

 

Delivery Time:
 
Order Conditions
Standard Delivery Date
The fastest Delivery Date
Prototype ( <20pcs)
2days
8hours
Small Volume (20-100pcs)
6days
12hours
Medium Volume (100-1000)
3days
24hours
Mass Production (>1000)
Depends on BOM
Depends on BOM
 
UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold 0