1-32 Layer HDI Quick Turn Rigid Flex Pcb Fabrication 3mil Line Width

Place of Origin China
Brand Name IBE
Certification ISO/TS16949 ISO13485
Model Number Electricity Meter PCBA
Minimum Order Quantity 10
Price $0.1-$0.5
Packaging Details ESD bag
Delivery Time 5-8 working days
Payment Terms D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000pcs/week
Product Details
Min. Line Width 0.075mm/0.075mm(3mil/3mil) Surface Finishing ENIG
Copper Thickness 1oz Base Material FR4
Min. Line Spacing 0.075mm Board Thickness 1.6mm
Min. Hole Size 0.25mm Soldermask Color Green
Silkscreen Color White Layer 1-32L
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32 Layer hdi pcb fabrication


HDI Quick Turn Rigid Flex Pcb


3mil Quick Turn Rigid Flex Pcb

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Product Description

Multilayer HDI Quick Printed Circuit Board &PCBA Rigid Flexible PCB

PCBA Capability

PCB Manufacturing Capability
PCB Layers:1Layers to 18 layer (Max)
Board thickness:0.13~6.0mm
Min line width/space:3mil
Min mechanical hole size:4mil
Copper thickness:9um~210um(0.25oz~6oz)
Max aspect ratio:1:10
Max board size:400*700mm
Surface Finish:HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material:FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range:1560*450mm
Min SMT package:0402/1005(1.0x0.5mm)
Min IC pitch:0.3mm
Max PCB Size:1200*400mm
Min PCB thickness:0.35mm
Min Chip Size:01005
Max BGA Size:74*74mm
BGA Ball Pitch:1.00~3.00mm
BGA Ball Diameter:0.4~1.0mm
QFP Lead Pitch:0.38~2.54mm
Testing :ICT,AOI,X-RAY,Funtional test etc.


Our Advantages:
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

1MaterialPR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2Board ThicknessMass Production:0.3-3.5mm Samples:0.21-6.0mm
3Surface FinishHASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4PCB Panel SizeMax Mass Productoin: 610x460mm Sample:762x508mm
5LayerMass production:2-58 Layers, Samples:1-64 Layers
6Min. Drill Hole SizeLaser Drill 0.1mm,Machine Drill 0.2mm
7PCBA QCX-ray,AOI Test,Functional Test
8SpecialityAutomotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9SanforizedBuried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control